The Meyer Burger team is pleased to personally invite you to visit us at our booth B3-178 at the upcoming productronica, November 14-17, 2017 in Munich (Germany). At the show we will be presenting our full range of manufacturing equipment for printed and flexible electronics, foremost our industrial JETx inkjet printing equipment, our FLEx Thin Film Encapsulation and Moisture Barrier equipment and technology.
Fast developments in the industrialization of functional inkjet printing are driving our innovation in printing equipment and processes. We are looking forward to updating you on our advancements in the PiXDRO JETx production printer range which is equipped with highest precision stages and high throughput print head technology. Due to its modular design, the JETx printers are ready for printing conductive, dielectric, resist, adhesive and other functional materials for applications in printed and flexible electronics, OLEDs, sensors, PCB, semiconductors, MEMS, chemical machining, 3D printing, photovoltaics, life science, and optics.
You will also discover our latest innovations in FLEx Thin Film Encapsulation equipment, providing a fully integrated cluster solution for multi-layer barriers for OLEDs, OPV, thin film batteries, and other sensitive flexible devices.
You’ll find a wealth of application examples at our booth B3-178. Visit us and discover how our solution portfolio will meet the challenges of tomorrow. We are looking forward to meeting you at productronica in Munich.
Meyer Burger Sales Team
Please e-mail to if you’d like to arrange a meeting.
Do not miss the Exhibitor Presentation in the TechArena by Dr. Sebastian Gatz (Technical Sales Manager)
on Tuesday, November 14: 12.00pm
You are cordially invited to join the presentation at FLEX Europe by Luca Gautero (Senior Process Development Engineer)
on Thursday, November 16: 3.20pm
Find more on www.meyerburger.com