Welcome to Meyer Burger at PE USA

The Meyer Burger team is pleased to personally invite you to visit us at our booth E16 at the upcoming Printed Electronics USA, November 15-16, 2017 in Santa Clara, CA (USA). At the show we will be presenting our full range of manufacturing equipment for printed and flexible electronics, foremost our industrial JETx inkjet printing equipment, our FLEx Thin Film Encapsulation and Moisture Barrier equipment and technology.

Fast developments in the industrialization of functional inkjet printing are driving our innovation in printing equipment and processes. We are looking forward to updating you on our advancements in the PiXDRO JETx production printer range which is equipped with highest precision stages and high throughput print head technology. Due to its modular design, the JETx printers are ready for printing conductive, dielectric, resist, adhesive and other functional materials for applications in printed and flexible electronics, OLEDs, sensors, PCB, semiconductors, MEMS, chemical machining, 3D printing, photovoltaics, life science, and optics.

You will also discover our latest innovations in FLEx Thin Film Encapsulation equipment, providing a fully integrated cluster solution for multi-layer barriers for OLEDs, OPV, thin film batteries, and other sensitive flexible devices.

You’ll find a wealth of application examples at our booth E16. Visit us and discover how our solution portfolio will meet the challenges of tomorrow. We are looking forward to meeting you at PE USA in Santa Clara, CA.

Yours sincerely,

Meyer Burger Sales Team

Please e-mail to if you’d like to arrange a meeting.

Do not miss the presentation in the Exhibition Theater by Don Veri (Sales and Business Development Manager)

Development in production equipment for flexible and printed elcetronics

on Wednesday, November 15: 2.40pm

Find more on www.meyerburger.com

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