PiXDRO JETx

Inkjet Printer for Mass Production

The PiXDRO JETx mass production inkjet printer is Meyer Burger’s most advanced platform for printing functional materials. It has a modular architecture and can be configured for a wide range of applications such as printed electronics, photo voltaic, OLED encapsulation, PCB solder masking, semiconductor packaging and chemical machining. The JETx is designed for 24/7 fully automated production, and is typically configured for processing large volumes of customer specific products.

The JETx systems have a granite base for superior stability and extremely high stage accuracy and printing precision, combined with high throughput and lowest cost of ownership. It is based on three standard platforms, the JETx-P, S and M, each system targeting specific application areas and product sizes.

Key Advantages

  • Granite base for high stability and printing precision
  • Modular architecture enables fast and reliable application specific functionality
  • High reliability and productivity
  • Flexible process flow editor
  • Customizable configuration for best cost of ownership and process control
  • Compatible with solvent based, aqueous, hot melt and UV-curable inks
  • Easy to operate and maintain

Main Features and Options

  • Multi printhead arrays
  • Multiple ink supply systems
  • Recirculating ink supply for nano-particle inks
  • In-line UV, photonic and NIR pinning and curing
  • Advanced fiducial and substrate alignment
  • Print inspection stations
  • Downflow control for clean environment
  • Glovebox integration for inert environment
  • Automatic substrate handling
  • Connectivity to other processing equipment
  • Temperature controlled substrate chuck
  • Multi-lane substrate handling
  • MES interface for factory automation
  • Please inquire at Meyer Burger for more options

Technical Data

JETx-P JETx-S JETx-M
Maximum substrate size 150 x 150 mm 300 x 400 mm 460 x 610 mm
(18 x 24 inch)
Max. substrate thickness 10 mm 20 mm 20 mm
Substrate clamping Vacuum Vacuum (optionally mechanical assist) Vacuum (optionally mechanical assist)
Base frame Steel Granite Granite
Stage accuracy +/- 15 µm (3σ) +/- 5 µm (3σ) +/- 5 µm (3σ)
Stage precision +/- 3 µm (3σ) +/- 2 µm (3σ) +/- 2 µm (3σ)
Motion X, Y, Z, Rz X, Y, Z, Rz X, Y, Z (Rz optional)
Print speed Up to 1000 mm/s
Printheads 128 – 2048 nozzles per head; 2 – 80 pL dropsize
Printhead exchange time < 15 minutes, automatic calibration
Maintenance (optional) Fast nozzle scan, spitting, capping, wiping
Vision systems (optional) Drop view, print image view, pattern inspection
User interface Intuitive touch screen (according to SEMI E10)
Image formats Bitmap, Gerber, TIFF, postscript, PDF
Ink types Solvent based, nano-particle, aqueous, hotmelt, UV-curable
Ink viscosity 2 – 20 cP
Ink supply Automatic ink refill (static or recirculating)
Integrated post processing (optional) UV pinning, UV curing, NIR curing
Footprint (w x d x h) Depending on configuration 1200 x 1700 x 2000 mm 1500 x 2000 x 2000 mm
Weight 1200 – 1800 kg 1200 kg 1800 kg
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