The Meyer Burger team is pleased to personally invite you to visit us at our booth B3-178 at the upcoming productronica, November 14-17, 2017 in Munich (Germany). At the show we will be presenting our full range of manufacturing equipment for printed and flexible electronics, foremost our industrial JETx inkjet printing equipment, our FLEx Thin Film Encapsulation and Moisture […]
The Meyer Burger team is pleased to personally invite you to visit us at our booth B1-1815 at the upcoming SEMICON Europa taking place from November 14-17, 2017 in Munich (Germany).
The Meyer Burger team is pleased to personally invite you to visit us at our booth E16 at the upcoming Printed Electronics USA, November 15-16, 2017 in Santa Clara, CA (USA). At the show we will be presenting our full range of manufacturing equipment for printed and flexible electronics, foremost our industrial JETx inkjet printing equipment, our FLEx Thin Film […]
Meyer Burger develops integrated tools containing FLEx LT and PiXDRO JETx tools for the thin film encapsulation of sensitive electronics like OLEDs and thin film photovoltaic devices. The FLEx LT PECVD tool is mainly for …
The JETx platform allows rapid configuration and building of industrial inkjet printing tools for optimum throughput, product quality, cost of ownership and reliability in 24/7 operation. The tools are based on established building blocks, …
Meyer Burger is launching a new product next to their existing product line of PiXDRO production and R&D printers. Starting from the 2nd quarter of 2017, the company is offering the core printing module of the JETx production printer family as a separate product. The so called JETx-Engine is enabling original equipment manufacturers to develop […]
Meyer Burger (Netherlands) announces a major extension of its JETx family of functional inkjet production tools. The family now includes standard configurations for printed products as small as several square inches up to several square meters, covering all segments of the materials printing industry. The modular JETx hardware and software architecture allows Meyer Burger to […]
Meyer Burger will exhibit its Thin Film Encapsulation and Barrier Film technologies at LOPEC. The technology is key in the production of flexible and sensitive electronic devices. It replaces glass encapsulation in OLED lighting and display panels offering equivalent moisture and oxygen barrier functionality at reduced device thickness and weight in combination with improved flexibility […]
PV Nano Cell Ltd. , an innovative producer of single-crystal, metal nanometric based conductive digital inks, today announced that they are cooperating with Meyer Burger.
Digital and additive manufacturing technologies like inkjet printing of functional materials are finding their way into all kinds of industrial manufacturing processes.
Insulectro, the US largest supplier of materials for use in the printed circuit board and printed electronics, will show a functioning printed electronics ink printer provided by Meyer Burger that will demonstrate additive, drop-on-demand, digital inkjet printing at IPC APEX (booth 3733/3833).
Meyer Burger (Netherlands) has received an order for multiple JETx SMP inkjet production printers for the application of solder mask from a major European PCB manufacturer. The order represents a strong signal from the PCB market that it is ready to adopt inkjet printing of solder mask and its many benefits as compared to existing […]
Meyer Burger has shipped a CONx TFE thin film encapsulation system consisting of an inkjet printer and PECVD system to an Asian customer for encapsulation of OLEDs and other flexible electronics applications. This latest order confirms the market’s recognition of Meyer Burger’s integral and fully automated thin film encapsulation system.