Entries by Frans Bijnen

Welcome to Meyer Burger at productronica

The Meyer Burger team is pleased to personally invite you to visit us at our booth B3-178 at the upcoming productronica, November 14-17, 2017 in Munich (Germany). At the show we will be presenting our full range of manufacturing equipment for printed and flexible electronics, foremost our industrial JETx inkjet printing equipment, our FLEx Thin Film Encapsulation and Moisture […]

Welcome to Meyer Burger at PE USA 2017

The Meyer Burger team is pleased to personally invite you to visit us at our booth E16 at the upcoming Printed Electronics USA, November 15-16, 2017 in Santa Clara, CA (USA). At the show we will be presenting our full range of manufacturing equipment for printed and flexible electronics, foremost our industrial JETx inkjet printing equipment, our FLEx Thin Film […]

CONx TFE on AZoNetwork

Meyer Burger develops integrated tools containing FLEx LT and PiXDRO JETx tools for the thin film encapsulation of sensitive electronics like OLEDs and thin film photovoltaic devices. The FLEx LT PECVD tool is mainly for …

PiXDRO JETx on AZoNetwork

The JETx platform allows rapid configuration and building of industrial inkjet printing tools for optimum throughput, product quality, cost of ownership and reliability in 24/7 operation. The tools are based on established building blocks, …

Meyer Burger announces inkjet module for OEM applications

Meyer Burger is launching a new product next to their existing product line of PiXDRO production and R&D printers. Starting from the 2nd quarter of 2017, the company is offering the core printing module of the JETx production printer family as a separate product. The so called JETx-Engine is enabling original equipment manufacturers to develop […]

Meyer Burger launches full range JETx functional inkjet platform

Meyer Burger (Netherlands) announces a major extension of its JETx family of functional inkjet production tools. The family now includes standard configurations for printed products as small as several square inches up to several square meters, covering all segments of the materials printing industry. The modular JETx hardware and software architecture allows Meyer Burger to […]

Meyer Burger to showcase Thin Film Encapsulation technology at LOPEC

Meyer Burger will exhibit its Thin Film Encapsulation and Barrier Film technologies at LOPEC. The technology is key in the production of flexible and sensitive electronic devices. It replaces glass encapsulation in OLED lighting and display panels offering equivalent moisture and oxygen barrier functionality at reduced device thickness and weight in combination with improved flexibility […]